1. 2. 3. material content data sheet sales product name bsb012ne2lxi issued 29. august 2013 ma# MA001050800 package mg-wdson-2-8 weight* 82.84 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.494 4.22 4.22 42179 42179 leadframe non noble metal copper 7440-50-8 74.415 89.84 89.84 898298 898298 leadfinish non noble metal nickel 7440-02-0 0.211 0.25 2549 noble metal silver 7440-22-4 0.840 1.01 1.26 10140 12689 plating non noble metal nickel 7440-02-0 0.211 0.25 0.25 2549 2549 glue plastics epoxy resin - 0.160 0.19 1936 noble metal silver 7440-22-4 0.985 1.19 1.38 11895 13831 solder non noble metal copper 7440-50-8 0.011 0.01 133 noble metal silver 7440-22-4 0.066 0.08 795 non noble metal tin 7440-31-5 2.119 2.56 2.65 25574 26502 passivation plastics epoxy resin - 0.327 0.40 0.40 3952 3952 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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